FUXANG ELECTRONICS CO., LIMITED                                        English   Chinese
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　PCB Assemblies Productions
 DVB main PCB Assembly Description
Layer: 4 layer  (2-12Layer available)
Material:FR-4  (FR-4 High TG,CEM-1CEM-3,FR-2 available)
Board thickness:1.6mm  (0.2-3.0mm available)
Copper thickness: 35um (35-105um available)
Minline:0.12mm                                                         Drill hole:0.25-6.35mm                                   Surface finish: HAL (Immersion Gold Plating Gold,OSP, Immersion Tin also available)                 Process outside: Route, (punch V-cut etc. also available)
All of our products meet ROHS standard.
　
 GPS  PCB Assembly Description
Layer: 6 layer  (2-12Layer available)
Material:FR-4  (FR-4 High TG,CEM-1CEM-3,FR-2 available)
Board thickness:1.2mm  (0.2-3.0mm available)
Copper thickness: 35um (35-105um available)
Minline:0.12mm                                                         Drill hole:0.25-6.35mm                                   Surface finish: Immersion Gold (HAL  Plating Gold,OSP, Immersion Tin also available)                 Process outside: Route, (punch, V-cut etc. also available)
All of our products meet ROHS standard.
   
  Transfers PCB Assembly Description
Layer: 2 layer  (2-12Layer available)
Material:FR-4  (FR-4 High TG,CEM-1CEM-3,FR-2 available)
Board thickness:1.6mm  (0.2-3.0mm available)
Copper thickness: 35um (35-105um available)
Minline:0.12mm                                                         Drill hole:0.25-6.35mm                                   Surface finish: HAL ( Immersion Gold,Plating Gold,OSP, Immersion Tin also available)                 Process outside: Route, (punch V-cut etc. also available)
All of our products meet ROHS standard.
　
 DVB PCB Description
Layer: 2 layer  (2-12Layer available)
Material:FR-4  (FR-4 High TG,CEM-1CEM-3,FR-2 available)
Board thickness:1.6mm  (0.2-3.0mm available)
Copper thickness: 35um (35-105um available)
Minline:0.12mm                                                         Drill hole:0.25-6.35mm                                   Surface finish: HAL (Immersion Gold Plating Gold,OSP, Immersion Tin also available)                 Process outside: Route, (punch V-cut etc. also available)
All of our products meet ROHS standard. 
   
 Power supplier PCB Assembly Description
Layer: 1 layer  (2-12Layer available)
Material:FR-4  (FR-4 High TG,CEM-1CEM-3,FR-2 available)
Board thickness:1.6mm  (0.2-3.0mm available)
Copper thickness: 70um (35-105um available)
Minline:0.2mm                                                         Drill hole:0.25-6.35mm                                   Surface finish: HAL (Immersion Gold Plating Gold,OSP, Immersion Tin also available)                 Process outside: Route, (punch V-cut etc. also available)
All of our products meet ROHS standard. 
   PCB Assembly Description
Layer: 4 layer  (2-12Layer available)
Material:FR-4  (FR-4 High TG,CEM-1CEM-3,FR-2 available)
Board thickness:0.8mm  (0.2-3.0mm available)
Copper thickness: 35um (35-105um available)
Minline:0.12mm                                                         Drill hole:0.25-6.35mm                                   Surface finish: HAL (Immersion Gold,Plating Gold,OSP, Immersion Tin also available)                 Process outside: Route, (punch V-cut etc. also available)
All of our products meet ROHS standard.  　
   
 Mobile Phone PCB Assembly Description
Layer: 8 layer  (2-12Layer available)
Material:FR-4  (FR-4 High TG,CEM-1CEM-3,FR-2 available)
Board thickness:1.6mm  (0.2-3.0mm available)
Copper thickness: 35um (35-105um available)
Minline:0.12mm                                                         Drill hole:0.25-6.35mm                                   Surface finish: Immersion Gold (HAL, Plating Gold,OSP, Immersion Tin also available)                 Process outside: Route, (punch V-cut etc. also available)
All of our products meet ROHS standard.  　
 Elevator control PCB Description
Layer: 2 layer  (2-12Layer available)
Material:FR-4  (FR-4 High TG,CEM-1CEM-3,FR-2 available)
Board thickness:1.6mm  (0.2-3.0mm available)
Copper thickness: 70um (35-105um available)
Minline:0.2mm                                                           Drill hole:0.25-6.35mm                                       Surface finish: Plating Gold (Immersion Gold, HAL,OSP, Immersion Tin also available)                 Process outside: Route, (punch V-cut etc. also available)
All of our products meet ROHS standard.
   
 Telecom PCB Assembly Description
Layer: 2 layer  (2-12Layer available)
Material:FR-4  (FR-4 High TG,CEM-1CEM-3,FR-2 available)
Board thickness:1.6mm  (0.2-3.0mm available)
Copper thickness: 35um (35-105um available)
Minline:0.2mm                                                         Drill hole:0.25-6.35mm                                   Surface finish: HAL (Immersion Gold Plating Gold,OSP, Immersion Tin also available)                 Process outside: Route, (punch V-cut etc. also available)
All of our products meet ROHS standard.

　
　
Electronic Scale PCB Description
 Layer: 2 layer  (2-12Layer available)
Material:FR-4  (FR-4 High TG,CEM-1CEM-3,FR-2 available)
Board thickness:1.6mm  (0.2-3.0mm available)
Copper thickness: 70um (35-105um available)
Minline:0.4mm                                                         Drill hole:0.25-6.35mm                                   Surface finish: Plating Gold (Immersion Gold, HAL,OSP, Immersion Tin also available)                 Process outside: Route V-cut, (punch, etc. also available)
All of our products meet ROHS standard.
　
   


Fuxang  Electronics  Co. Limited

HK office: Flat/Rm B 8/F Chong Ming Bldg,72 Cheung Sha Wan RD Kowloon, HongKong    Tel:+852-23192933  Fax:+852-23195168

Shenzhen office: Rm505,Yongbiao Building, Xili Town, Nanshan District, Shenzhen, China        Tel:+86-755-26344548     Fax:+86-755-26620819